Paper Title
Contact Structures For Assembling Integrated Circuits On The Basis Of Electrolytic Alloys Of Peritectic Composition

Abstract
In the article there have been discussed physical and chemical properties of electrochemical deposition of peritectic alloys for high-density mounting of silicon chips. There has been conducted research in co-deposition and layer-by-layer deposition of materials for the formation of soldering contact structures of tin-silver peritectic composition. Keywords- Contact structure, 3D - installation, peritectic alloys, electrochemical deposition, Tin-Silver.